IEC IEC61190-1-3 Edition 3.02017-12 NTERNATIONAL STANDARD NORME INTERNATIONALE Attachment materialsforelectronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non- fluxed solid solder for electronic soldering applications Materiauxdefixationpourlesassemblagesélectroniques- Partie 1-3: Exigences relatives aux alliages a braser de categorie électronique et brasure solide fluxee et non-fluxee pour les applications de brasage electronique IEC 61190-1-3:2017-12(en-fr) THIS PUBLICATIONIS COPYRIGHTPROTECTED Copyright@2017IEC,Geneva,Switzerland or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from eitherIEC or IEC's memberNational Committee in the countryof the requester. if you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, piease contact the address below or your local IEC member National Committee for further information. Droits de reproduction reserves. Sauf indication contraire, aucune partie de cette publication ne peut etre reproduite ni utilisée sous quelque forme que ce soit et par aucun procede, électronique ou mecanique, y compris la photocopie et les microfilms, sans I'accord ecrit de I'IEC ou du Comite national de I'IEC du pays du demandeur. Si vous avez des questions sur le copyright de IlEC ou si vous désirez obtenir des droits supplementaires sur cette publication, utilisez les coordonnees ci-apres ou contactez le Comite national de I'IEC de votre pays de residence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varembe Fax: +41 22 919 03 00 CH-1211 Geneva 20
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